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      • Memory >
        • Samsung 21nm TLC NAND Flash
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        • SanDisk 20nm Flash
      • MCU/Processor
      • RF
      • Power Management >
        • AC/DC
        • DC/DC
        • BUCK
        • Boost
        • Driver
        • LDO
        • Regulator
        • Power Management
      • Sensor >
        • Qualcomm Snapdragon Sense ID sensor
      • RFID
      • Frequency Synthesizers
      • ADC/DAC
      • Power Amplifier
      • Other ICs
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  • Home
  • Lab
    • Decapsulation
    • Delayering
    • Imaging
    • Process Analysis
  • Engineering
    • Focus Areas >
      • Memory >
        • Samsung 21nm TLC NAND Flash
        • Samsung V-NAND Flash
        • SanDisk 20nm Flash
      • MCU/Processor
      • RF
      • Power Management >
        • AC/DC
        • DC/DC
        • BUCK
        • Boost
        • Driver
        • LDO
        • Regulator
        • Power Management
      • Sensor >
        • Qualcomm Snapdragon Sense ID sensor
      • RFID
      • Frequency Synthesizers
      • ADC/DAC
      • Power Amplifier
      • Other ICs
    • RE Software
    • For Semiconductor Manufacturer
    • For IP firms
  • Reports
    • Device Library
    • Report Format
  • Contact

focus areas

ScienceVision covers most technical areas of the IC industry: 
• Memory, including DRAM, SRAM, Flash, EEPROM, and more;
• RF(wired and wireless devices contain transceivers, mixers, and more); 
• Power management (DC/DC, AC/DC, LED/LCD driver);
• Sensor (image sensor, touch screen, optical sensor for optical fiber communication);
• RFID and smart card
• Frequency synthesizer (PLL, DLL, and clock generator)
• Analog-to-digital converters (ADC) and digital-to-analog converters (DAC)
• Power amplifier (audio amplifier, regulator, high/low power designs)
• Other large integrated chips includes microprocessors, image processors, digital signal processors (DSP), field programmable gate array (FPGA), and complex programmable logic devices (CPLD).

DRAM has proven to be a cyclical market with intense competition. Moore's Law has been driving the evolution of the integrated chip but it seems to be nearing its limit and DRAM manufacturers are facing enormous challenges. Nowadays, even a small percentage shrink in die size can be the determining factor between success and failure.

ScienceVision is dedicated towards device acquisition, detailed reports, and depth in DRAM services so our clients can stay on the leading edge of this challenging market.

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